Tungsten-copper alloy combines the advantages of metal tungsten and copper, among which tungsten has a high melting point (tungsten melting point is 3410 ° C, copper melting point is 1080 ° C), high density (tungsten density is 19.34g/cm3, copper density is 8.89 g/cm3) ; Copper has excellent electrical and thermal conductivity, tungsten-copper alloys (generally ranging from WCu7 to WCu50) have uniform microstructure, high temperature resistance, high strength, arc ablation resistance, and high density; moderate electrical and thermal conductivity, widely used in military high temperature resistant materials , Electrical alloys for high-voltage switches, electrical processing electrodes, and microelectronic materials are widely used in aerospace, aviation, electronics, electric power, metallurgy, machinery, sports equipment and other industries as parts and components.

Tungsten copper alloys are used as nozzles, gas rudders, air rudders, and nose cones of missiles and rocket engines in aerospace. The main requirements are high temperature resistance (3000K~5000K) and high temperature airflow scouring ability. It mainly uses copper to volatilize at high temperatures. The resulting sweating and cooling effect (the melting point of copper is 1083°C) reduces the surface temperature of tungsten copper and ensures that it can be used under extreme conditions of high temperature.

Tungsten copper alloy is widely used in high-voltage switch 128kV SF6 circuit breaker WCu/CuCr, high-voltage vacuum load switch (12kV 40.5KV 1000A), and arrester. High-voltage vacuum switch is small in size, easy to maintain, and has a wide range of applications. Use in flammable, explosive and corrosive environments. The main performance requirements are arc ablation resistance, anti-welding resistance, small cut-off current, low gas content, and low thermal electron emission capability. In addition to the conventional macro performance requirements, porosity and microstructure properties are also required. Therefore, special processes are required, and complex processes such as vacuum degassing and vacuum infiltration are required.

1. High-performance materials for aerospace

Tungsten copper material has the properties of high density, perspiration cooling performance, high temperature strength and erosion resistance. Wait.

2. Vacuum contact material

The contact material must have very good machinability and thermal shock resistance. Due to arcing during contact and breaking, the temperature of the contact material will rise by several thousand degrees Celsius in a fraction of a second. The W-Cu contact material produced by our company is widely used due to its excellent physical properties.

Advantages: high ablation resistance, high toughness, good electrical and thermal conductivity. Good machining performance.

3. Electrodes for EDM

When machining cemented carbide products with EDM, the copper or graphite electrodes wear out quite quickly due to the special properties of WC. For EDM machining of this material, the W-Cu electrodes produced by our company are the most suitable.

Product performance: high electrical corrosion rate, low loss rate, precise electrode shape, excellent processing performance, and good surface quality of WC.

 4. Electronic packaging materials

W-Cu electronic packaging material has both the low expansion properties of tungsten and the high thermal conductivity properties of copper. What is particularly valuable is that its thermal expansion coefficient and thermal conductivity can be designed by adjusting the composition of the material. The application brings great convenience. We use high-purity and high-quality raw materials, and obtain W-Cu electronic packaging materials and heat sink materials with excellent performance after pressing, high-temperature sintering and infiltration. Materials suitable for packaging with high-power devices, such as substrates, lower electrodes, etc.; high-performance lead frames; thermal control boards and radiators for military and civilian thermal control devices.

Advantages: thermal expansion coefficient and high thermal conductivity matching with different substrates; excellent high temperature stability and uniformity; excellent processing performance;